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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T A =25°C unless otherwise specified.
Symbol
V S
V B
V HO
V DD
V IN
dV S /dt
P D
? JA
T J
T STG
Characteristics
High-Side Floating Offset Voltage
High-Side Floating Supply Voltage
High-Side Floating Output Voltage
Low-Side and Logic Supply Voltage
Logic Input Voltage
Allowable Offset Voltage Slew Rate
Power Dissipation (2, 3, 4)
Thermal Resistance
Junction Temperature
Storage Temperature
Min.
V B -25
-0.3
V S -0.3
-0.3
-0.3
-55
-55
Max.
V B +0.3
625.0
V B +0.3
25.0
V DD +0.3
± 50
0.625
200
+150
+150
Unit
V
V
V
V
V
V/ns
W
? C/W
? C
? C
Notes:
2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
3.
Refer to the following standards:
JESD51-2: Integrated circuits thermal test method environmental conditions, natural convection, and
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages.
4. Do not exceed power dissipation (P D ) under any circumstances.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
V B
V S
V HO
V IN
V DD
T A
Parameter
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Logic Input Voltage
Supply Voltage
Operating Ambient Temperature
Min.
V S +10
6-V DD
V S
GND
10
-40
Max.
V S +20
600
V B
V DD
20
+125
Unit
V
V
V
V
V
? C
? 2010 Fairchild Semiconductor Corporation
FAN73611 ? Rev. 1.0.0
4
www.fairchildsemi.com
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